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Thermal Management & Adhesives for Electronics

Choosing a thermal interface material (TIM) that will work in an electronic application, an engineer might consider power density, heat dissipation, bond line thickness, processing requirements, and reworkability.

Additionally, they consider thermally conductive adhesive tapes that can provide high mechanical strength plus good surface wetting and excellent shock absorption in these electronic applications.

Electronics OEMs are looking for converters, like Fabrico, to provide:

  • Precision die-cutting, multi-layer laminating, and slitting to tight tolerances
  • Access to a range of thermal management solutions
  • Testing capabilities

Fabrico selects from servo driven rotary die-cutting, CNC die-cutting, laser die-cutting, and water jet die-cutting to meet the complex specifications of thermal management for electronic components.

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