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Heat Dissipation and EMI/RFI Shielding

To meet the never-ending demand for improved performance, electronics manufacturers are packing more and more hardware onto printed circuit boards and fitting additional components into shrinking chassis.

But along with better performance comes a serious problem for manufacturers: as electronic assemblies become smaller and more powerful, they generate increasing amounts of heat.

For expert assistance in meeting these thermal-management and EMI/RFI shielding needs, firms specializing in the conversion of flexible materials, like Fabrico, are there to assist the manufacturers.

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