You are here

Henkel Bergquist Gap Pad HC 3.0 Offers Exceptional Thermal Performance and Conformability at Low Pressures for High Performance Applications

  • Outstanding Thermal Conductivity in a Soft Conformable Pad

    Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. The enhanced 3.0 W/m-K rated material is well suited for high performance applications requiring low assembly stress.

    Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

    Product Features and Typical Applications

    Gap Pad® HC 3.0 provides the following features and benefits:

    • Thermal conductivity: 3.0 W/m-K
    • Highly conformable, low compression stress
    • Fiberglass reinforced for shear and tear resistance


    Typical applications for Gap Pad® HC 3.0 include:

    • Telecommunications
    • Consumer electronics
    • ASICs and DSPs
    • Thermal modules to heat sinks


    Click Here to download a Technical Data Sheet