Henkel Bergquist Gap Pad HC 3.0 Offers Exceptional Thermal Performance and Conformability at Low Pressures for High Performance Applications

Outstanding Thermal Conductivity in a Soft Conformable Pad

Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. The enhanced 3.0 W/m-K rated material is well suited for high performance applications requiring low assembly stress.

Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

Product Features and Typical Applications

Gap Pad® HC 3.0 provides the following features and benefits:

• Thermal conductivity: 3.0 W/m-K
• Highly conformable, low compression stress
• Fiberglass reinforced for shear and tear resistance

Typical applications for Gap Pad® HC 3.0 include:

• Telecommunications
• Consumer electronics
• ASICs and DSPs
• Thermal modules to heat sinks

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