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Henkel Bergquist Gap Pad® HC 3.0 Thermally Conductive Gap Filling Material

Overview: 

Henkel Bergquist Gap Pad® HC 3.0

Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation.

Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. The enhanced material 3.0 W/m-K rated material is well suited for high performance applications requiring low assembly stress.

Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.

Features: 

  • Thermal Conductivity: 3.0 W/m-k
  • Highly conformable, low compression stress
  • Fiberglass reinforced for shear and tear resistance

Typical Applications: 

  • Telecommunications
  • Consumer electronics
  • ASICs and DSPs
  • Thermal modules to heat sinks
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