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Product Spotlight

Henkel Bergquist Gap Pad HC 3.0 Offers Exceptional Thermal Performance and Conformability at Low Pressures for High Performance Applications

Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation.

Henkel Bergquist Gap Pad HC 3.0