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Henkel Bergquist Gap Pad HC 3.0 Offers Exceptional Thermal Performance and Conformability at Low Pressures for High Performance Applications
Outstanding Thermal Conductivity in a Soft Conformable Pad
Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. The enhanced 3.0 W/m-K rated material is well suited for high performance applications requiring low assembly stress.
Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.
Product Features and Typical Applications
Gap Pad® HC 3.0 provides the following features and benefits:
- Thermal conductivity: 3.0 W/m-K
- Highly conformable, low compression stress
- Fiberglass reinforced for shear and tear resistance
Typical applications for Gap Pad® HC 3.0 include:
- Consumer electronics
- ASICs and DSPs
- Thermal modules to heat sinks
Click Here to download a Technical Data Sheet