You are here

Henkel Bergquist Gap Pad® HC 3.0 Thermally Conductive Gap Filling Material

Data Sheets & Summary Sheets
  • Henkel Bergquist Gap Pad® HC 3.0

    Gap Pad® HC 3.0 is a soft gap filling material rated at a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K filler package and low-modulus resin formulation.

    Gap Pad® HC 3.0 maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. The enhanced material 3.0 W/m-K rated material is well suited for high performance applications requiring low assembly stress.

    Gap Pad® HC 3.0 is offered with natural inherent tack on one side of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® HC 3.0 is supplied with protective liners on both sides.


    • Thermal Conductivity: 3.0 W/m-k
    • Highly conformable, low compression stress
    • Fiberglass reinforced for shear and tear resistance

    Typical Applications: 

    • Telecommunications
    • Consumer electronics
    • ASICs and DSPs
    • Thermal modules to heat sinks