Fabrico has many years of experience servicing the electronics industry, providing converted materials for applications such as EMI/RFI shielding, labels, and masking.

Thermal Management. Fabrico offers thermally conductive materials – in some cases die cut with adhesive backing – for heat spreading and as interface materials between high-power components and heat sinks.

EMI/RFI Shielding. Fabrico has broad experience with EMI/RFI shielding materials, including tapes with aluminum and copper backings for grounding, bonding, and shielding. Conductive and nonconductive adhesive systems are available. Having selected the optimal material for the application, Fabrico offers die cutting and laminating services to meet the needs of the specific application.

Labels. Fabrico provides an extensive line of laser markable, multi-layer label materials that are ideal for high-end serialized, bar coded, and variable information labels. This specialty material is die cut and formed into custom shapes, ready for laser marking, with or without adhesive backing.

Masking. Fabrico provides materials for masking electronic circuit boards in support of component assembly operations. Materials are first slit to the proper width, then die cut to specific shapes to fit the required footprint. Adhesive-backed masking kits are available, which put all masking needs for an application on a single peelable liner.

Bonding, Joining, Fastening. Fabrico assembly solutions create product efficiencies and enhance the ruggedness of finished products to withstand the abuse of challenging environments.